Photonic Packaging

Figure 1: Laser welding of single mode optical fibre in 14-pin butterfly package for tunable diode laser.
Figure 1: Laser welding of single mode optical fibre in 14-pin butterfly package for tunable diode laser.

Research

The Tyndall Institute has made a strategic investment in a state-of-the-art packaging laboratory that supports development of advanced photonic devices and integrated systems. Through these facilities and highly experienced research staff, Tyndall has the ability to develop advanced photonic prototypes from start to finish, ready for evaluation and demonstration. To-date, photonic packaging researchers have been working on a range of technologies for application across a number of key industry sectors, including telecommunications, medical devices, biotechnology and consumer electronics. Many of these research activities are preformed through industry collaborations and are expected to grow as photonics becomes the technology of choice for an increasing range of applications.

Areas of research include: the development of packaging and integration techniques for high speed photonic devices, packaging for silicon photonics and the development of packaging solutions for bio and medical photonic based systems. The core team is lead by Dr. Peter O’Brien who previously founded a photonics life science company and also worked as a research scientist at the California Institute of Technology and NASA’s Jet Propulsion Laboratory.

Key equipment includes:  flip-chip, fibre-welding, planar waveguide packaging, ribbon and gold ball wirebonders, submount/thin-film/solder processing and advanced reliability/failure analysis. These facilities are supported by simulation and design capabilities in micro-optics, thermo-mechanics and high speed electronics. Funding for research activities is achieved through national (Science Foundation Ireland and Enterprise Ireland), international (FP7, ESA) and industrial collaborative research programmes (SME and multi-nationals). 

Team

Peter O'Brien

 

Peter O'Brien

Marc Rensing

 

Marc Rensing

Noreen Nudds

 

Noreen Nudds  

Xin Wang

 

 Xin Wang

Brad Snyder

 

Brad Snyder

 Evan Ryan

 

Evan Ryan

 Dr. Pierpalo Porta

Pierpaolo Porta

Cormac Eason    

 

Contact: 

Dr. Peter O'Brien

Head of Group (Photonics Packaging)

Deputy Director (SFI-Irish Phtonics Integration Centre)

Tyndall National Institute,

University College Cork, Ireland

 

Phone:  +353 21 490 4841

Mobile: +353 87 9213309

Email:  peter.obrien@tyndall.ie

 

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